This research program is to explore the fabrication of novel metal matrix composites (MMCs) as an alternative to existing microelectronic packaging materials with improved performance. The unique properties associated with MMCs, such as Al alloy/SiC particulate, include low density, dimensional stability, matched thermal expansion, high thermal conductivity, and electrically conducting. Together with tailored mechanical properties, MMCs can provide unprecedented opportunities for efficient and reliable packaging design. Representing potential applications for Al alloy/SiCp MMCs, specific components include microwave housing, thermal planes, heat spreaders, junctions, and SEM boxes, supporting high power electronics and commercial PCs and other electronic devices. The scientific objective of the present investigation is to enhance our understanding of the fundamental mechanisms that govern the processing-microstructure-mechanical behavior synergism in Al alloy/SiCp MMCs. The technological objective of the project is to develop novel MMCs that can be explored for applications in microelectronics packaging.